Autor: |
Keyvan Kashefizadeh, Nancy Fung, T. E. Sato, Nitin K. Ingle, W. Xu, W. Lei, Benjamin Colombeau, Anchuan Wang, Yu Lei, Ajay Bhatnagar, Ashish Pal, P. Wang, Sanjay Natarajan, D. Cui, Angada B. Sachid, Avgerinos V. Gelatos, Blessy Alexander, C. Lee, B. Brown, D. Hwang, Sean M. Seutter, K. Mikhaylichenko, T. H. Ha, M. Kawasaki, Yi Xu, Buvna Ayyagari, J. Ferrell, M. Cogorno, El Mehdi Bazizi, T. Luu |
Rok vydání: |
2020 |
Předmět: |
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Zdroj: |
2020 IEEE Symposium on VLSI Technology. |
DOI: |
10.1109/vlsitechnology18217.2020.9265043 |
Popis: |
Materials technology co-optimization (MTCO) modeling is used for the first time to simulate Performance-Power-Area (PPA) benefits of self-aligned gate contact (SAGC) technology. We also demonstrate a process flow to integrate novel CMOS compatible materials and processes to enable SAGC at the 3nm node and below. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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