Effect of Sn Addition on the SCC Properties of Al-Cu-Mn Cast Alloy

Autor:	In-Bae Kim, Byeong-Hun Lee, Gyeong-Hyeon Kim
Rok vydání:	2002
Předmět:	Materials science Alloy Metallurgy Intergranular corrosion engineering.material Fatigue limit Intergranular fracture stomatognathic diseases Electrical resistivity and conductivity Ultimate tensile strength engineering General Materials Science Grain boundary Stress corrosion cracking
Zdroj:	Korean Journal of Materials Research. 12:436~441-436~441
ISSN:	2287-7258 1225-0562
DOI:	10.3740/mrsk.2002.12.6.436
Popis:	Effect of Sn addition on the stress corrosion cracking(SCC) resistance of the Al-Cu-Mn cast alley was investigated by C-ring teat and electrical conductivity measurement, The electrical conductivity and SCC resistance increased by Sn addition. The alley containing 0,10%Sn showed maximum electrical conductivity and the best SCC resistance. At the same composition, the electrical conductivity and SCC resistance increased from peak aged condition to ever aged condition. The PFZ and coarse precipitates along the grain boundary were observed from TEM micrographs. The fracture mode of the alloy was confirmed as intergranular type and showed brittle fracture surface. The SCC mechanism of the alloy was concluded as the anodic dissolution model, The maximum hardness was increased from 130Hv in the Sn-free alloy to 156Hv in the 0.10%Sn added alloy.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bfbdcbd79ada31b23488c327f01b1569 https://doi.org/10.3740/mrsk.2002.12.6.436 Zobrazit plný text záznamu