Crack analysis using a hybrid numerical manifold method with node-based strain smoothing and double-interpolation

Autor:	Wenshuai Han, Shuhong Wang, Wenfang Liu, Wenpan Sun, Qinkuan Hou, Simiao Zhang, Wei Wei
Rok vydání:	2022
Předmět:	Mechanics of Materials Mechanical Engineering General Materials Science
Zdroj:	Engineering Fracture Mechanics. 273:108685
ISSN:	0013-7944
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bf8885c41efb05fad1c2f64f1f1ce48c https://doi.org/10.1016/j.engfracmech.2022.108685 Zobrazit plný text záznamu Full Text from ScienceDirect