Atomic diffusion of Zn in Sn-Zn based solder joints subjected to high temperature aging
| Autor: | Zhi-Jun Yue, Long Xiao, Gong Zhang, Jian-Chun Liu |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Materials science Intermetallic chemistry.chemical_element 02 engineering and technology Zinc 021001 nanoscience & nanotechnology Microstructure 01 natural sciences Atomic diffusion Nickel Atomic layer deposition chemistry Soldering 0103 physical sciences Composite material Diffusion (business) 0210 nano-technology |
| Zdroj: | 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS). |
| Popis: | The diffusion behavior of Zn in Sn-8Zn-3Bi solder joints was investigated during long-time aging at 160 °C. Intermetallic compounds (IMCs) were formed at the interface, which were identified as Ni-Zn. Thickness of the IMCs layer increased whereas the growth rate decreased with time. It was found that the growth kinetic of the IMCs was diffusion control. A diffusion model was thus proposed to describe the diffusion behavior of Zn during long-term aging, which appeared to provide a good agreement with the microstructure evolution. |
| Databáze: | OpenAIRE |
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