Planar Interconnect Technologies
| Autor: | Terry C. Edwards, Michael B. Steer |
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| Rok vydání: | 2016 |
| Předmět: | |
| Zdroj: | Foundations for Microstrip Circuit Design ISBN: 9781118936160 Foundations for Microstrip Circuit Design, Fourth Edition |
| DOI: | 10.1002/9781118936160.ch5 |
| Popis: | Interconnect technologies continue to evolve as operating frequencies increase and compactness results in increased coupling of signals on adjacent interconnects. This chapter discusses planar interconnect technologies, and examines several alternative transmission line structures. High‐speed interconnects on semiconductor chips (integrated circuits (ICs)), stacked ICs (3DICs), and multichip modules (MCMs) (and also on card) are now extending into gigabit rates, which means that transmission line design issues apply. The chapter lists a variety of possible substrate materials for planar transmission lines. The combination of thick‐ and thin‐film hybrid microcircuit technology and ‘chip’ components such as microwave transistors has formed a powerful design vehicle for modern integrated systems. The chapter reviews the essential properties of PCBs, and discusses the design of hybrid and monolithic circuits, with a specific emphasis on the circuit design itself, that is, not active devices. |
| Databáze: | OpenAIRE |
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