| Autor: |
Jian Li, Fang Juan Qi, Min Xie, Ying Ming Shen |
| Rok vydání: |
2011 |
| Předmět: |
|
| Zdroj: |
Advanced Materials Research. :929-933 |
| ISSN: |
1662-8985 |
| DOI: |
10.4028/www.scientific.net/amr.291-294.929 |
| Popis: |
The effect of nano-Cu particles on mechanical bend reliability of micro-joining joint with Sn-3.5Ag lead free solder was studied in this paper. The results show that 0.5% nano-Cu composite lead free solder show significantly better shearing strength and mechanical bend fatigue properties than eutectic Sn-3.5Ag solder paste, 1.0% nano-Cu composites and 1.5% nano-Cu composites. The further analysis shows that adding nano-Cu particles make much effect on intermetallic (IMC) in the interface of micro-joint and the inside of the solder joint. The different interface of micro-joining joint induced different mechanical properties. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
