Reticle Exposure Plans for Multi-Project Wafers

Autor:	Da-Wei Hsu, Rung-Bin Lin, Meng-Chiou Wu, Ming-Hsine Kuo
Rok vydání:	2007
Předmět:	Engineering business.industry Volume (computing) ComputerApplications_COMPUTERSINOTHERSYSTEMS Hardware_PERFORMANCEANDRELIABILITY Edge (geometry) Automotive engineering Wafer fabrication Hardware_INTEGRATEDCIRCUITS Reticle Electronic engineering Wafer testing Wafer business
Zdroj:	DDECS
DOI:	10.1109/ddecs.2007.4295308
Popis:	A reticle exposure plan for a multi-project wafer (MPW) defines the sites where reticle images are printed on the wafer. In this paper, we propose an approach to finding a reticle exposure plan that minimizes the wafer fabrication cost rather than the number of wafers. Our approach achieves up to 20% reduction in wafer fabrication cost for low-volume production and 4% reduction for higher volume production when compared to a method that simply minimizes the number of wafers. We also find that printing partial reticle images on wafer edge does not pay off for low-volume production and is marginally better for higher volume production.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bec2505f16d81d1fc832ad523dac4666 https://doi.org/10.1109/ddecs.2007.4295308 Zobrazit plný text záznamu