| Autor: |
Wilson Pradeep, Atul Chhabra, Anil K. Malik, Sameer Chillarige, Bharath Nandakumar, Prakash Narayanan |
| Rok vydání: |
2019 |
| Předmět: |
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| Zdroj: |
2019 IEEE International Test Conference India (ITC India). |
| Popis: |
Need for competitive part with reduced cost of build is pushing the boundaries of scan compression adoption in high volume designs. This opens up multiple challenges in effective failure diagnosis, especially in deep sub nanometer designs with higher defect densities and higher probabilities of multi-defect failures. While there are many conventional methods available to address this challenge, they largely suffer from poor accuracy or are time intensive; more particularly at higher scan compression. In this paper, we present a new robust multiple defect diagnosis algorithm and methodology, aimed at achieving high accuracy and resolution in the presence of multiple defects independent of the compression solution implemented. We also present summary from a detailed evaluation conducted to study the efficacy of the proposed diagnostic methodology. Experimental results on a 45nm industrial design indicate significant improvement in accuracy and resolution at 450X high scan compression using the proposed methodology. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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