Diffusion Creep of Silicon during Direct Silicon Wafer Bonding

Autor:	Alex A. Kamanin, E. Belyakova, V.V. Ratnikov, Sang Cheol Kim, Eun Dong Kim, N. M. Shmidt
Rok vydání:	2001
Předmět:	Radiation Materials science Silicon chemistry.chemical_element Diffusion creep Strained silicon Thermocompression bonding Condensed Matter Physics Monocrystalline silicon chemistry Anodic bonding General Materials Science Wafer LOCOS Composite material
Zdroj:	Defect and Diffusion Forum. :667-672
ISSN:	1662-9507
DOI:	10.4028/www.scientific.net/ddf.194-199.667
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::be7713bc881f75e3600cc41cbf7ec504 https://doi.org/10.4028/www.scientific.net/ddf.194-199.667 Zobrazit plný text záznamu