Design and Optimization of Microchannel in a Fan-out Package for Heat Dissipation

Autor:	Bo Sun, Weize Zhang, Chunbing Guo, Chengqiang Cui
Rok vydání:	2022
Zdroj:	2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc56328.2022.10013216
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::be5ebbd5849b1e0286cd64de40035ff4 https://doi.org/10.1109/eptc56328.2022.10013216 Zobrazit plný text záznamu