| Autor: |
Johannes Plauth, Allan Dunbar, Giovanni Rivera, Guido Miraglia, Merritt Phillips, Pui Leng Lam, Elisabetta Castellana, Laura Rozzoni |
| Rok vydání: |
2000 |
| Předmět: |
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| Zdroj: |
SPIE Proceedings. |
| ISSN: |
0277-786X |
| Popis: |
ATHENA is the new alignment system designed to minimize the alignment offset due to mark-deformation as induced by a WCMP process. We report the results of its evaluation at STMicroelectronics for a 0.25 μm-device which employs six metal-interconnect layers (metal layer thicknesses ranging from 4000 A to 8000A) obtained by a W-CMP process. ATHENA's sensitivity to process variations on resist coating, \VCMP pad-aging, metal-deposition effect, oxide thickness variation, and differences in the alignment scheme has been investigated. Results of the characterization were implemented on volume production to verify the overlay-performances under presence of natural process-fluctuations of a W-CMP backend-process. Final results show the robustness of ATHENA system: The process-induced contribution to the overlayerror is below 15 nm. A stable performance is obtained with a maximum overlay-error below 60 nm over a period of 4 months under manufacturing conditions. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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