Method to improve ball grid array Imax distribution for small form factor package design

Autor:	Jimmy Huat Since Huang, Chin Lee Kuan, Jackson Chung Peng Kong, Bok Eng Cheah
Rok vydání:	2015
Předmět:	Engineering Electrical resistance and conductance business.industry Chip-scale package Ball grid array Electronic engineering Ball (bearing) Mechanical engineering Integrated circuit packaging Quad Flat No-leads package Power network design business Small form factor
Zdroj:	2015 6th Asia Symposium on Quality Electronic Design (ASQED).
DOI:	10.1109/acqed.2015.7274009
Popis:	Maximum current (Imax) distribution across substrate has been one of the major design factors that govern the electronic package form factor. Particularly on ball grid array (BGA) package design, often times Imax distribution determines the number of solder balls required for each interface to sustain respective workloads hence defines the total ball count and the x-y dimension of the electronic package. This paper introduces a new method to improve BGA Imax distribution while keeping ball count minimal for to enable small form-factor package design. The proposed solution utilizes fundamental of electrical resistance control through on-board BGA pad design customization to achieve more uniform Imax distribution across solder balls and enable up-to 25% Imax reduction with negligible IR drop impact. Power losses across plane were also simulated and compared against conventional design in this study.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bd7963bb5cb7a556381297c5c8834e37 https://doi.org/10.1109/acqed.2015.7274009 Zobrazit plný text záznamu