Interfacial IMC growth behavior and mechanical properties of Cu/Sn58Bi/Cu and Cu/Sn58Bi–0.05AlN/Cu solder joints under ultrasonic-assisted soldering

Autor:	Xi Wang, Liang Zhang, Chen Chen, Xiao Lu, Wei-min Long
Rok vydání:	2023
Předmět:	Electrical and Electronic Engineering Condensed Matter Physics Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials
Zdroj:	Journal of Materials Science: Materials in Electronics. 34
ISSN:	1573-482X 0957-4522
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bd68a626ba2992da9a837ba8c8f08e47 https://doi.org/10.1007/s10854-022-09609-4 Zobrazit plný text záznamu Full text from SpringerLink