Out-of-plane Bending Vibration Fracture Test of Polycrystalline Silicon Thin-film Membrane

Autor:	Toshiyuki Tsuchiya, Osamu Tabata, Yukihiro Takeuchi, Hiroyuki Wado, Tomoki Tanemura, Shuichi Yamashita
Rok vydání:	2012
Předmět:	Materials science Bending vibration business.industry Mechanical Engineering Fracture test Structural engineering engineering.material Out of plane Membrane Polycrystalline silicon Surface roughness engineering Electrical and Electronic Engineering Thin film Composite material business
Zdroj:	IEEJ Transactions on Sensors and Micromachines. 132:224-229
ISSN:	1347-5525 1341-8939
DOI:	10.1541/ieejsmas.132.224
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bd510364b657afc74b0c1c8b92e1522d https://doi.org/10.1541/ieejsmas.132.224 Zobrazit plný text záznamu