Emerging applications of intermetallics

Autor: C.T. Liu, Seetharama C. Deevi, N.S. Stoloff
Rok vydání: 2000
Předmět:
Zdroj: Intermetallics. 8:1313-1320
ISSN: 0966-9795
DOI: 10.1016/s0966-9795(00)00077-7
Popis: Many intermetallic compounds display an attractive combination of physical and mechanical properties, including high melting point, low density and good oxidation or corrosion resistance. This has led to their utilization in many non-structural applications, but success in structural applications has, to date, been limited. This paper reviews the current status of intermetallic applications, with emphasis on new uses that are in place or pending. Most of the paper deals with aluminides and silicides, but there are several more complex intermetallics that are being employed in battery and magnetic applications. Research on improved processing and studies of the role of environment in mechanical behavior are shown to be key to developing practical alloys.
Databáze: OpenAIRE