Aerosol Jet Cleaning of Silicon Wafer Surfaces

Autor:	James R. Brock, Isaac Trachtenberg, Po-Sheng Chang
Rok vydání:	1993
Předmět:	Jet (fluid) Materials science Silicon chemistry.chemical_element respiratory system Particulates equipment and supplies complex mixtures Microbiology Aerosol chemistry Surface roughness Wafer Supersonic speed Thin film Composite material
Zdroj:	MRS Online Proceedings Library. 315:249-254
ISSN:	1946-4274 0272-9172
DOI:	10.1557/proc-315-249
Popis:	A new wafer cleaning technique, Aerosol Jet Cleaning (AJC), using a supersonic liquid aerosol jet was studied. AJC has been used to remove effectively both particulate and thin film contaminants from silicon wafer surfaces. Submicron polystyrene latex spheres, micron sized spherical silica particles and irregular silicon dust were successfully removed from silicon substrates using a supersonic ultrafine liquid methanol aerosol jet. The cleaning efficacy of the methanol AJC for thin film contaminants such as fingerprints has also been shown to be very effective. Surface roughness of silicon substrates before and after clean-up by AJC was measured with an atomic force microscope and virtually no change in surface roughness was observed in these studies.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bcb94ac76daf68f434fb14d108e920d2 https://doi.org/10.1557/proc-315-249 Zobrazit plný text záznamu Full text from SpringerLink