Evaluation of Thermal Shock Resistance Using Precracked Specimens
| Autor: | Hiroshi Uchimura, Yoshihiro Takeshita |
|---|---|
| Rok vydání: | 1995 |
| Předmět: |
Quenching
Thermal shock Materials science General Chemistry Condensed Matter Physics chemistry.chemical_compound Fracture toughness Silicon nitride chemistry Soldering visual_art Materials Chemistry Ceramics and Composites visual_art.visual_art_medium Ceramic Natural fracture Composite material Material properties |
| Zdroj: | Journal of the Ceramic Society of Japan. 103:563-569 |
| ISSN: | 1882-1022 0914-5400 |
| DOI: | 10.2109/jcersj.103.563 |
| Popis: | Thermal shock resistance of silicon nitride was evaluated by a quenching test using precracked specimens and molten solder as a cooling medium. A thermal shock parameter, Rc (=ΔTc*⋅√C), which corresponds to fracture toughness and is obtained easily from a general quenching test has been defined. Here, C is the half length of a precrack and ΔTc* is the applied temperature difference when the first small propagation of the precrack is observed. As a result, it was confirmed that Rc is almost constant regardless of the crack length and temperature dependence of material properties. In addition, a critical temperature difference for an uncracked specimen was predicted from ΔTc* and C using an equivalent crack length of natural fracture origin. This numerical prediction was also applied to the estimation of the thermal shock resistance of other ceramics. |
| Databáze: | OpenAIRE |
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