Thermal Conductivity of Open-Cell Copper Foam Based Thermal Interface Component

Autor:	Minami Teranishi, Yuki Ishizaka, Kazuyoshi Fushinobu, Shinya Kawakita
Rok vydání:	2019
Předmět:	Materials science Thermal conductivity chemistry Component (thermodynamics) Interface (computing) Thermal chemistry.chemical_element Open cell Composite material Copper
Zdroj:	The Proceedings of the Thermal Engineering Conference. 2019:0027
ISSN:	2424-290X
DOI:	10.1299/jsmeted.2019.0027
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bca08e8645cd2ac872c413903520cacc https://doi.org/10.1299/jsmeted.2019.0027 Zobrazit plný text záznamu