Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints

Autor:	R. S. Lai, Kwang-Lung Lin, B. Salam
Rok vydání:	2008
Předmět:	Materials science Chemical engineering Soldering Metallurgy Materials Chemistry Intermetallic Electrical and Electronic Engineering Condensed Matter Physics Layer (electronics) Electronic Optical and Magnetic Materials Total thickness
Zdroj:	Journal of Electronic Materials. 38:88-92
ISSN:	1543-186X 0361-5235
Popis:	Cu5Zn8 normally forms between Sn-Zn solder and Cu metallization. In this study, the growth of the intermetallic compound (IMC) layer is slowed by increasing the silver content in the Sn-8.5Zn-Ag-Al-Ga/Cu system. Experimental results showed that the total thickness of the IMC layers formed with 1.5 wt.% silver content was about half that without silver. The reduction might be due to the formation of the intermetallic compound (Ag,Cu)-Zn at the interface in addition to silver.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bc8827250d6ea1db82976e594c6e7d32 https://doi.org/10.1007/s11664-008-0579-0 Zobrazit plný text záznamu Full text from SpringerLink