Solvents for Sealing Microfluidic Devices Made of Polymethyl Methacrylate by Chemical Solvent Bonding

Autor:	T. A. Lukashenko, A. L. Bulyanitsa, A. I. Tsymbalov, Anatoly Evstrapov, A. N. Zubik
Rok vydání:	2021
Předmět:	Materials science Polymers and Plastics Polymethyl methacrylate General Chemical Engineering Microfluidics General Chemistry Microstructure chemistry.chemical_compound Volume (thermodynamics) chemistry Chemical engineering Vinyl acetate Ethyl acrylate Solvent bonding
Zdroj:	Polymer Science, Series D. 14:350-355
ISSN:	1995-4220 1995-4212
DOI:	10.1134/s1995421221030175
Popis:	Based on qualitative and quantitative criteria, solvents compatible with polymethyl methacrylate (PMMA) such as ethyl acrylate, n-butylacrylate, and vinyl acetate were selected. Features of the solvent-bonded seam of non-detachable bonding of PMMA of various grades obtained using the selected solvents were investigated. It is shown that the method of chemical solvent bonding with vinyl acetate can be an alternative to gluing in sealing of microchips, since the solvent-bonded seam makes a smaller contribution to the change in the working volume of microstructures than the glue seam.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bc3ff2d26a95529d74f86da1da43c632 https://doi.org/10.1134/s1995421221030175 Zobrazit plný text záznamu Full text from SpringerLink