Electronic Packaging: Semiconductor Packages ☆

Autor: Fred Barlow, Aicha Elshabini, P.J. Wang
Rok vydání: 2017
Předmět:
DOI: 10.1016/b978-0-12-803581-8.02048-8
Popis: Electronic packages contain numerous transistors and integrated circuits, resistors, capacitors, inductors, diodes, in addition to other components, linked through interconnections to form various functional entities. As functional densities increase, the level of integration of the inner circuitry continues to increase on the chip level. Electronic packaging serves a few critical functions such as signal distribution, power distribution, thermal management, rigidity, mechanical stability, and circuitry protection.
Databáze: OpenAIRE