Fabrication and measurement of BPF using IPD technology

Autor:	C. M. Lai, Zhang Li, Guo Hongyan, K. H. Tan, Bian Xinhai
Rok vydání:	2014
Předmět:	Engineering business.industry Electrical engineering Inductor Footprint (electronics) visual_art Electronic component visual_art.visual_art_medium Electronic engineering Miniaturization Insertion loss Wireless Radio frequency business Mobile device
Zdroj:	2014 15th International Conference on Electronic Packaging Technology.
DOI:	10.1109/icept.2014.6922579
Popis:	Band-pass-filters (BPF) are critical components in the RF modules. Conventional discrete component solutions, like those from discrete SMDs or LTCC (Low temperature co-fired ceramic) technology. Typically, these passive components consume 60%–70% of the footprint area. As miniaturization is becoming a trend for cost-reduction of wireless products, there is a need to make these devices in smaller form-factors. Integrated passive devices (IPDs) have attracted much attention in recent years, primarily due to the need of handheld and wireless devices to further decrease in cost and size and increase in functionality.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bbbd775368f38c1723defc9d4f354004 https://doi.org/10.1109/icept.2014.6922579 Zobrazit plný text záznamu