Microslip of Wafer Pressed by Spring
| Autor: | Yuuji Takeda, Kunitoshi Nishimura |
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| Rok vydání: | 1992 |
| Předmět: | |
| Zdroj: | TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C. 58:3063-3068 |
| ISSN: | 1884-8354 0387-5024 |
| Popis: | When an object is pressed by a spring and fixed with friction force, microslippage often occurs because of an external force lower than the predictable value. This is because the object is pressed not only by the normal force but also by the tangential force. This paper presents a microslip model in which the obiect supported by spring forces in the normal and tangential directions is subjected to sinusoidal external force. The study shows both analytically and experimentally that larger tangential force produces larger microslip. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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