Current-assisted direct Cu/Cu joining

Autor:	Min Suk Suh, Ki Bum Kim, Young Ho Kim, Nam-Seog Kim, Chanho Shin, Jeong Hwan Lee, Sung Woo Ma
Rok vydání:	2015
Předmět:	Materials science Mechanics of Materials Mechanical Engineering Diffusion Contact resistance Metallurgy Fracture load Metals and Alloys General Materials Science Current (fluid) Condensed Matter Physics Joule heating Electromigration
Zdroj:	Scripta Materialia. 104:21-24
ISSN:	1359-6462
Popis:	Enhanced direct Cu/Cu joining by applying current was investigated. Joining was conducted at 240–300 °C for 10–50 min under 40 MPa. Current was applied to Cu wire during joining. Contact resistance of joints decreased and the fracture load of joints increased as the current increased. The joined region increased and the interface became less straight as the current increased. These results are ascribed to electromigration and joule heating effects. The enhanced diffusion contributed significantly to the joining of metals.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bb48d17029ecd621ad50ddbb3401680e https://doi.org/10.1016/j.scriptamat.2015.03.016 Zobrazit plný text záznamu Full Text from ScienceDirect