Highly scalable flash memory with novel deep trench isolation embedded into highperformance cmos for the 90nm node & amp; beyond

Autor: Danny Pak-Chum Shum, Kyung Joon Han, R. Broze, Volker Hecht, A. Yang, R. Kakoschke, N. Chan, L. Pescini, Armin Tilke, Sung-Rae Kim, Martin Stiftinger
Rok vydání: 2006
Předmět:
Zdroj: IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..
DOI: 10.1109/iedm.2005.1609346
Popis: A flash memory cell with 90nm ground-rules has been embedded in a high performance (HP) CMOS logic process. A deep trench isolation (DTi) process module enables an isolated Pwell (IPW) bias scheme for the first time, leading to flash write/erase (W/E) by FN tunneling without GIDL, a key feature for low-power (LP) electronics. IPW leads to a compact cell design and a highly scalable high-voltage (HV) periphery through the narrow intrawell and interwell isolation spaces. The memory arrays are defined by DTi of each bitline (BL) from its neighboring BL. The HV bias can be scaled with a carefully designed retrograde triple-well that enables a symmetrical gate-well bias
Databáze: OpenAIRE