A New High Resolution Process for Passives in Hybrid Packaging

Autor:	Patrick F. Fleig, Charles D. E. Lakeman, Hope R. Perry
Rok vydání:	2008
Předmět:	Materials science Semiconductor Process (engineering) business.industry Electronic engineering High resolution business Engineering physics
Zdroj:	27th Annual Cocoa Beach Conference on Advanced Ceramics and Composites: B: Ceramic Engineering and Science Proceedings, Volume 24, Issue 4
DOI:	10.1002/9780470294826.ch10
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bb0ec5b2d4c7cf77d9a42ad6fb1779d2 https://doi.org/10.1002/9780470294826.ch10 Zobrazit plný text záznamu