Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders

Autor:	M. Renavikar, Rajen S. Sidhu, Nikhilesh Chawla, M. A. Dudek
Rok vydání:	2006
Předmět:	Materials science Solid-state physics Metallurgy Electronic packaging Intermetallic Condensed Matter Physics Microstructure Electronic Optical and Magnetic Materials Dendrite (crystal) Soldering Materials Chemistry Shear strength Electrical and Electronic Engineering Ductility
Zdroj:	Journal of Electronic Materials. 35:2088-2097
ISSN:	1543-186X 0361-5235
DOI:	10.1007/s11664-006-0318-3
Popis:	Sn-rich solders have been shown to have superior mechanical properties when compared to the Pb-Sn system. Much work remains to be done in developing these materials for electronic packaging. In this paper, we report on the microstructure and mechanical properties of La-containing Sn-3.9Ag-0.7Cu alloys. The addition of small amounts of La (up to 0.5 wt.%) to Sn-Ag-Cu refined the microstructure by decreasing the length and spacing of the Sn dendrites and decreased the thickness of the Cu6Sn5 intermetallic layer at the Cu/solder interface. As a result of the change in the microstructure, Sn-Ag-Cu alloys with La additions exhibited a small decrease in ultimate shear strength but significantly higher elongations compared with Sn-Ag-Cu. The influence of LaSn3 intermetallics on microstructural refinement and damage evolution in these novel solders is discussed. Our results have profound implications for improving the mechanical shock resistance of Pb-free solders.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::baf846c45cbb95d18aa2b061b2804f18 https://doi.org/10.1007/s11664-006-0318-3 Zobrazit plný text záznamu Full text from SpringerLink