Hybrid Stacked-Die Package Solution for Extremely Small-Form-Factor Package

Autor:	Heeseok Lee, Kyoung Min Lee, Daehan Youn, Kyojin Hwang, Junghwa Kim
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc51906.2022.00096
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::bac578835e96e49a91cdf04196d2f962 https://doi.org/10.1109/ectc51906.2022.00096 Zobrazit plný text záznamu