Thermomechanical Reliability Investigation of Carbon Nanotube Off-Chip Interconnects for Electronic Packages

Autor:	Nicholas J. Ginga, Suresh K. Sitaraman
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials
Zdroj:	IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1282-1292
ISSN:	2156-3985 2156-3950
DOI:	10.1109/tcpmt.2022.3194163
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ba2e942e3821c31a21104f0b99fa0c8d https://doi.org/10.1109/tcpmt.2022.3194163 Zobrazit plný text záznamu