Structure and phase stability of the chemically deposited Au layers on electrodeposited Ni and Ni–B layers
| Autor: | Velta Belmane, V. Rubene, Māra Lubāne, I. Vı̄tiņa, A. Knipele, Aija Krūmiņa |
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| Rok vydání: | 1999 |
| Předmět: |
Materials science
Metallurgy Alloy Non-blocking I/O Intermetallic chemistry.chemical_element Surfaces and Interfaces General Chemistry Thermal treatment engineering.material Condensed Matter Physics Copper Surfaces Coatings and Films law.invention Amorphous solid Nickel chemistry Chemical engineering law Materials Chemistry engineering Crystallization |
| Zdroj: | Surface and Coatings Technology. :430-437 |
| ISSN: | 0257-8972 |
| Popis: | Changes in the surface structure and phase composition of chemically deposited Au layers (thickness 0.1–0.3 μm) in the layer systems of Au/Ni–B/Cu and Au/Ni/Cu under various thermal treatments were studied by means of transmission and scanning electron microscopies and X-ray diffraction. It has been determined that the chemically deposited Au layer in the system of Au/Ni–B/Cu maintains its structure and phase stability, even after thermal treatment at 300°C for 200 h or at 400°C for 50 h, in spite of crystallization of the electrodeposited amorphous Ni–B layer and formation of the borides Ni 3 B, Ni 2 B. The electrodeposited amorphous Ni–B alloy contains 6.45–6.8 wt% of boron and (3.2–6)×10 −2 wt% of carbon. Formation of the intermetallics Cu 3 Au and Au x Cu y does not take place. Considerable dissolution of the chemically deposited Au into the electrodeposited Ni was observed after 100 h at 300°C, and after the 200 h, the Au layer was completely dissolved into the Ni layer. The further interdiffusion of gold, nickel and copper leads to the formation of such intermetallics as CuAu when heated at 300°C for 200 h. Cu 3 Au and Au x Cu y and NiO formation were observed after treatment at 400°C for 50 and 100 h. |
| Databáze: | OpenAIRE |
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