On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications
| Autor: | Andrew J. G. Strandjord, Jack E. Hetzner, Greg Meyers, Jang-Hi Im, David D. Hawn, A. Chakrabarti, E. O. Shaffer, Cheryl L. Karas, Steve Froelicher, T. M. Stokich, J. Curphy |
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| Rok vydání: | 1999 |
| Předmět: |
chemistry.chemical_classification
Materials science Silicon business.industry Electronic packaging chemistry.chemical_element Dielectric Polymer Computer Science Applications Electronic Optical and Magnetic Materials Reliability (semiconductor) X-ray photoelectron spectroscopy chemistry Mechanics of Materials Optoelectronics Thermal stability Electrical and Electronic Engineering Thin film business |
| Zdroj: | Journal of Electronic Packaging. 122:28-33 |
| ISSN: | 1528-9044 1043-7398 |
| DOI: | 10.1115/1.483128 |
| Popis: | This work examines the mechanical performance of thin film coatings from Photosensitive-benzocyclobutene (Photo-BCB) formulations (Cyclotene2 4024, 4026 and 7200), on various substrate surfaces such as Al, Cu, Si, and SiN. The adhesion promoter used was designated AP-3000 and was based on vinyltriacetoxysilane (VTAS), which had been properly hydrolyzed and advanced. Measurement of the interfacial adhesion was performed primarily using the modified Edge Liftoff Test m-ELT. It was found that, by applying the newly developed adhesion promoter, AP-3000, the interfacial energy of Photo-BCB to Al, Cu, Si, and SiN was significantly improved, often approaching the toughness of Photo-BCB, ca. 45 J/m2. The x-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) analyses of the delaminated surfaces of the Photo-BCB/Al structure revealed distinct differences in surface roughness and the chemical composition depending on whether or not adhesion promoter was used. Other parameters important for long term stability (e.g., moisture uptake and thermal stability) of Photo-BCB were also measured. The equilibrium moisture content at 84 percent RH in ambient temperature was low, 0.14 wt percent and the thermally induced weight loss at 330°C in helium atmosphere was less than 1 percent/h. The low moisture absorption and good thermal stability, together with the given mechanical toughness and adhesion, allow the Photo-BCB to be widely usable for various microelectronic packaging applications, for up to 40 μm thick build in the case of silicon substrate. [S1043-7398(00)00701-5] |
| Databáze: | OpenAIRE |
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