Novel low k Dielectric materials for nano device interconnect technology

Autor:	Son Nguyen, Hosadurga Shobha, Thomas Haigh, James Chen, Joe Lee, Takeshi Nogami, Eric Liniger, Stephan Cohen, Chao-Kun Hu, Huai Huang, Yiping Yao, Donald Canaperi, CorneliusBrown Peethala, Theo Standaert, Griselda Bonilla
Rok vydání:	2020
Zdroj:	Extended Abstracts of the 2020 International Conference on Solid State Devices and Materials.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b94334a8e74aad3bcfbd1c2177490063 https://doi.org/10.7567/ssdm.2020.c-1-01 Zobrazit plný text záznamu