A TSV-Based Bio-Signal Package With $\mu$-Probe Array

Autor:	Kuan-Neng Chen, Chi-Tsung Chiu, Ching-Te Chuang, Cheng-Hao Chiang, Ho-Ming Tong, Jin-Chern Chiou, Lei-Chun Chou, Chung-Hsi Wu, Po-Tsang Huang, Shih-Wei Lee, Kuo-Hua Chen, Shang-Lin Wu, Wei Hwang, Chih-Wei Chang
Rok vydání:	2014
Předmět:	Interconnection Engineering Wire bonding business.industry Sensing applications Electrical engineering Chip Signal Electronic Optical and Magnetic Materials Probe array CMOS Hardware_INTEGRATEDCIRCUITS Electronic engineering Electrical and Electronic Engineering business Lead (electronics)
Zdroj:	IEEE Electron Device Letters. 35:256-258
ISSN:	1558-0563 0741-3106
DOI:	10.1109/led.2013.2293399
Popis:	Bio-signal probes providing stable observation with high quality signals are crucial for understanding how the brain works and how the neural signal transmits. Due to the weak and noisy characteristics of bio-signals, the connected interconnect length between the sensor and CMOS has significant impact on the bio-signal quality. In addition, long interconnections with wire bonding technique introduce noises and lead to bulky packaged systems. This letter presents an implantable through-silicon via (TSV) technology to connect sensors and CMOS devices located on the opposite sides of the chip for brain neural sensing applications. With the elimination of traditional wire bonding and packaging technologies, the quality of bio-signal can be greatly improved.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b939916dab2c5b73603f14cbd5cdca27 https://doi.org/10.1109/led.2013.2293399 Zobrazit plný text záznamu