Harsh Fluid Resistant Silicone Encapsulants for the Automotive Industry

Autor: E. M. Walker, R. A. Schultz, J. Luo, K. L. Pearce
Rok vydání: 2002
Předmět:
Zdroj: Advanced Microsystems for Automotive Applications Yearbook 2002 ISBN: 9783642621147
DOI: 10.1007/978-3-642-18213-6_35
Popis: Silicone gels have found widespread use in automotive electronic applications as encapsulants and potting compounds for the protection of electronic devices. The continued decrease in size of electronic packages is enabling the placement of sensors closer to the point of measurement, for example under hood, on exhaust manifold, on wheels, on brakes etc. This is resulting in the necessity for protection materials that can withstand increasingly harsh environments: higher service temperatures and harsh chemicals, for example fuels, oils, acids and other aggressive automotive fluids. Silicone gels are known to protect sensitive electronics from mechanical and thermal stresses as well as dust and dirt. Fluorosilicones provide increased resistance to high operating temperatures and fluids such as fuels. Often these materials cannot provide protection from the diverse range of conditions typically encountered in these applications. Such conditions may include exposure to fuel and acids. Materials may fail due to polymer degradation, bulk swelling which allows corrosive fluids to permeate them, or more likely because the interface between the protective material and the package has failed.
Databáze: OpenAIRE