Optical method for validation of changes in the cleaning process and cleaning process optimization

Autor:	Ivan Szendiuch, Vladimir Sitko
Rok vydání:	2019
Předmět:	Electronic assemblies Reliability (semiconductor) Materials science business.industry Soldering Ion migration Process (computing) Process optimization Hardware_PERFORMANCEANDRELIABILITY Process engineering business Corrosion
Zdroj:	2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
DOI:	10.23919/empc44848.2019.8951759
Popis:	Currently, electronic assemblies are more complex and compact. Requirements on the reliability of electronic assemblies in a harsh environment are rapidly growing. Assemblies become dense, with small distances between poles. Processing of low and very high-frequency signals requires high values of surface insulation. Experiences confirm that using No-clean soldering technology has only limited efficiency in protection against leakage current, ion migration, and corrosion.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b91447b1ac4883ed8ac227471ce8c71e https://doi.org/10.23919/empc44848.2019.8951759 Zobrazit plný text záznamu