Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substrates
Autor: | Byoung-Joon Kim, Young-Chang Joo, Jihoon Lee, Hae-A. Seul Shin, Oliver Kraft, Tae-Youl Yang, In-Suk Choi, Thomas Haas, Patric A. Gruber |
---|---|
Rok vydání: | 2014 |
Předmět: |
chemistry.chemical_classification
Materials science Strain (chemistry) Mechanical Engineering Nucleation Polymer Bending Condensed Matter Physics chemistry Mechanics of Materials Ultimate tensile strength General Materials Science sense organs Dislocation Deformation (engineering) Composite material Ductility |
Zdroj: | Journal of Materials Research. 29:2827-2834 |
ISSN: | 2044-5326 0884-2914 |
DOI: | 10.1557/jmr.2014.339 |
Popis: | The thickness dependence of the electrical stability under monotonic and cyclic tensile loading is investigated for Cu films on polymer substrates. As for monotonic tensile deformation, thicker films show better stability than thinner films due to their higher ductility and the larger capability of strain accommodation. For the fatigue resistance, however, a more complex behavior was observed depending on the amount of the applied strain. For low strain amplitude in the high cycle fatigue (HCF) regime, thinner films exhibit longer fatigue life because the larger strength of thinner films suppresses dislocation movement and damage nucleation. However, for high strain amplitudes in the low cycle fatigue (LCF) regime, the fatigue life for thinner films is drastically reduced compared to thicker films. It is shown that fatigue coefficients in the LCF regime can be obtained when applying the Coffin–Manson relationship. |
Databáze: | OpenAIRE |
Externí odkaz: |