Autor:	Cheong Chiang Ng, Torsten Hauck
Rok vydání:	2019
Předmět:	Model order reduction Materials science Flow (psychology) Thermal Hardware_INTEGRATEDCIRCUITS Mechanical engineering Time resolution Thermal simulation Hardware_PERFORMANCEANDRELIABILITY Transient (oscillation) Finite element method Stimulus response
Zdroj:	2019 IEEE CPMT Symposium Japan (ICSJ).
DOI:	10.1109/icsj47124.2019.8998660
Popis:	An efficient thermal simulation flow for a package interconnected system at transient operating condition is demonstrated with full spatial and time resolution. Compact thermal models were developed as building blocks for virtual assembly of electronic packages.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b8995213db6a0cf922df9c4cd47fc38a https://doi.org/10.1109/icsj47124.2019.8998660 Zobrazit plný text záznamu