Post processing of a SiNy-based photonic stack above a CMOS imager sensor
| Autor: | Rita Van Hoof, Nga P. Pham, Gillis Winderickx, Bert Du Bois, H. K. Tyagi |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Fabrication
Materials science business.industry Photonic integrated circuit Physics::Optics 02 engineering and technology Grating Signal Optical spectrometer law.invention Resonator 020210 optoelectronics & photonics CMOS law 0202 electrical engineering electronic engineering information engineering Optoelectronics Photonics business |
| Zdroj: | 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC). |
| DOI: | 10.1109/eptc.2018.8654381 |
| Popis: | This paper presents the fabrication of a SiN y -based photonic integrated circuit (PIC) on top of a CMOS imager sensor (CIS) using semiconductor post processing fabrication technology. The photonic key components consists of SiN y optical waveguides (WG), grating in/out couplers and Cu vertical mirrors defining the resonator boundaries and the sloped Cu output mirrors. The optical signal (photons) from the photonics is converted by the CIS into an electrical signal for further data processing. This photonic integration technology can be used for a wide range of applications, e.g., an optical spectrometer. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|