Influence of oxidation of a multilayer metallization on the adhesion of an Sn-Sb solder

Autor:	Takashi Hosokawa, Ryuichi Saitoh, Yasutoshi Kurihara
Rok vydání:	1995
Předmět:	Materials science Computer Networks and Communications Nickel oxide Soldering Metallurgy General Physics and Astronomy Degradation (geology) Wetting Adhesion Electrical and Electronic Engineering
Zdroj:	Electronics and Communications in Japan (Part II: Electronics). 78:42-51
ISSN:	1520-6432 8756-663X
Popis:	The influence of oxidation of an Al-Cr-Ni-Ag multilayer metallization on the adhesion of Sn-5wt%Sb solder was investigated. Oxidation of the multilayer metallization prevents the solder from wetting the multilayer metallization uniformly. The nonuniform wetting of the solder caused localization of thermal stress on the wetted regions and promoted differential degradation of the regions. The interface between Ni and Ag was oxidized when exposed to air without cooling to a low temperature. The nickel oxide at the interface prevented the formation of metallurgical bonds between the multilayer metallization and the molten solder. In some interface regions where the molten solder eliminated the nickel oxide either chemically or physically, the solder wetted the multilayer metallization but did not wet in the regions where the nickel oxide was not eliminated.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b7fc3284c068415da2380537ff7bc616 https://doi.org/10.1002/ecjb.4420780205 Zobrazit plný text záznamu Plný text ve formátu PDF