Novel plasma process for build-up film in the fine wiring fabrication

Autor:	Daisuke Hironiwa, Yasuhiro Morikawa, Atsuhito Ihori, Ryuichiro Kamimura
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc51906.2022.00141
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b7b663e872bfb72ed9e4d2bf2fc06097 https://doi.org/10.1109/ectc51906.2022.00141 Zobrazit plný text záznamu