Machine vision system for alignment in die-to-wafer bonder

Autor: Jiyoung Chu, Minhwan Seo, Hyungjin Kim, Wondon Joo, Sungmin Ahn, Sangwoo Bae
Rok vydání: 2022
Zdroj: Optical System Alignment, Tolerancing, and Verification XIV.
Databáze: OpenAIRE