Reliability of Silicone and Epoxy Resin Encapsulated Power Modules in HV-H3TRB tests with Thin-Resin coated Dice
| Autor: | Felix Steiner, Helge Wurst, Benjamin Leyrer, Dai Ishikawa, Hideo Nakako, Thomas Blank |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 International Conference on Electronics Packaging (ICEP). |
| Databáze: | OpenAIRE |
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