Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration

Autor:	Sujong Kim, Hyunbin Nam, Namhyun Kang, Wonsik Hong
Rok vydání:	2021
Předmět:	Materials science Kirkendall effect Soldering Metallurgy Intermetallic Electromigration
Zdroj:	Journal of Welding and Joining. 39:89-102
ISSN:	2466-2232
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b7a648dc1bc1bc81a4447048f3a1174a https://doi.org/10.5781/jwj.2021.39.1.11 Zobrazit plný text záznamu