Beware of Artifacts When Characterizing Nanometer Device Features Smaller than a TEM Lamella Thickness in Semiconductor Wafer-foundries

Autor:	Raghaw Rai, Wayne Zhao, Esther Chen, Jeremy D. Russell, H. L. Porter
Rok vydání:	2014
Předmět:	Crystallography Materials science Lamella (surface anatomy) Nanometre Wafer Composite material Instrumentation
Zdroj:	Microscopy and Microanalysis. 20:1000-1001
ISSN:	1435-8115 1431-9276
DOI:	10.1017/s1431927614006722
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b791db274d1a5fa97a1f5d7ace972850 https://doi.org/10.1017/s1431927614006722 Zobrazit plný text záznamu