Thermal stability of a HfO2∕SiO2 interface

Autor: Takashi Nakagawa, Nobuyuki Ikarashi, Koji Watanabe, Koji Masuzaki
Rok vydání: 2006
Předmět:
Zdroj: Applied Physics Letters. 88:101912
ISSN: 1077-3118
0003-6951
DOI: 10.1063/1.2182023
Popis: Using high-angle annular-dark-field scanning transmission electron microscopy, we showed how annealing at 1000°C changes the chemical composition distribution at a HfO2∕SiO2 interface. The observed change in the distribution was analyzed in terms of Hf diffusion in SiO2; the diffusion coefficient was estimated to be 2.5×10−18cm2∕s. This diffusion coefficient indicates that the high-temperature annealing, such as that in the conventional dopant activation process used to fabricate semiconductor devices, barely changes the chemical composition distribution at the HfO2∕SiO2 interface.
Databáze: OpenAIRE