Temperature-Aware Evaluation and Mitigation of Logic Soft Errors Under Circuit Variations

Autor: Warin Sootkaneung, Sasithorn Chookaew, Suppachai Howimanporn
Rok vydání: 2021
Zdroj: 2021 IEEE 30th Asian Test Symposium (ATS).
DOI: 10.1109/ats52891.2021.00018
Databáze: OpenAIRE