Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology—Sensing Head Interfacing

Autor:	Shiying Chen, Chunjiang Jia, Paul McKeever, Mike Barnes, D.S. Vilchis-Rodriguez, Sinisa Djurovic
Rok vydání:	2022
Předmět:	Materials science business.industry Interfacing Thermal Electrical engineering Head (vessel) Insulated-gate bipolar transistor Electrical and Electronic Engineering business Instrumentation
Zdroj:	IEEE Sensors Journal. 22:1309-1320
ISSN:	2379-9153 1530-437X
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b6eda93b8f630ef9b32b44575ebaec42 https://doi.org/10.1109/jsen.2021.3131322 Zobrazit plný text záznamu