PCB Channel Optimization Techniques for High-Speed Differential Interconnects

Autor:	Li Wern Chew, Cheng Yu Tan, Ming Dak Chai, Yun Rou Lim
Rok vydání:	2022
Zdroj:	2022 International Conference on Electronics Packaging (ICEP).
DOI:	10.23919/icep55381.2022.9795393
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b6d16e1a9ffa3d9fdac1f7c5b2b400e5 https://doi.org/10.23919/icep55381.2022.9795393 Zobrazit plný text záznamu