Numerical Simulation on Conform Process of Aluminum Alloy Rectangular Hollow Conductor
| Autor: | Shui Sheng Xie, Lei Cheng, Guo Jie Huang, Yu Cai Wu, Peng Yue Wu |
|---|---|
| Rok vydání: | 2007 |
| Předmět: |
Materials science
business.product_category Field (physics) business.industry Mechanical Engineering Constitutive equation Forming processes Structural engineering Condensed Matter Physics Finite element method Conductor Stress field Mechanics of Materials Die (manufacturing) General Materials Science Extrusion Composite material business |
| Zdroj: | Materials Science Forum. :735-740 |
| ISSN: | 1662-9752 |
| DOI: | 10.4028/www.scientific.net/msf.546-549.735 |
| Popis: | In the investigation, the continuous extrusion forming (CONFORM) process of aluminum alloy rectangular hollow conductor has been studied by three-dimensional finite-element method based on Software DEFORM-3D. The rigid-viscoplastic constitutive equation was employed in the model. Distributions of velocity field, strain field, stress field and temperature field were obtained in the forming process. The results will give effective guidelines to optimize the processing parameters and to select, the die structure and die materials. |
| Databáze: | OpenAIRE |
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