Integrated tool for the spreading, thermal treatment and in situ process monitoring of thick photoresist films
| Autor: | M. Chatzichrisitidi, Ioannis Raptis, Evangelos Valamontes, D. Goustouridis |
|---|---|
| Rok vydání: | 2010 |
| Předmět: |
Materials science
business.industry Nanotechnology Photoresist Condensed Matter Physics Casting Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention Surface micromachining Resist law Microsystem Microelectronics Electrical and Electronic Engineering Photolithography business Lithography |
| Zdroj: | Microelectronic Engineering. 87:1115-1119 |
| ISSN: | 0167-9317 |
| Popis: | In micromachining - microsystems applications the patterning of resist films with thickness of several tens of microns is common. The processing conditions of such thick resist films are quite different from the ones used in mainstream microelectronics. For example in the case of SU-8 the Post Apply Bake (PAB) should be done in two different temperatures in order to prepare a compact film with limited amount of remaining casting solvent. In this direction several processing tools have been developed. In the present work an integrated processing tool for the application of thick resist films and their thermal processing (PAB and Post Exposure Bake, PEB) is presented. In addition, the tool is equipped with a single wavelength interferometer to monitor in real-time the film thickness variations during the thermal processing steps in order to optimize the processing conditions towards the lithographic performance. The preparation of two epoxy based resists is characterized and first lithographic results using this tool are presented. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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